Hi-link semiconductor fingerprint recognition module HLK-ZW0906 capacitive touch fingerprint door lock acquisition sensor module test kit/development board
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Buycount：
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Price$5.32
Product introduction
Fingerprint identification module is used for user's identity determination, when the user touches the fingerprint identification module with his/her finger, the fingerprint identification module will scan the user's fingerprints, and the algorithm chip can obtain the fingerprint image data for registration and comparison operation. This product is suitable for various applications that require fingerprint identification.
Parameters
Technical indicators
| Item | Parameter |
| Storage | 100 fingerprint data as standard |
| Sensor type | Capacitive touch sensor |
| Resolution | 508DPI |
| FRR. | <3% |
| FAR. | <0.001% |
| Fingerprint sensor shape | round |
| Image gray level | 8-bit grayscale |
| Service life | one million times |
| Static electricity test | Contact discharge ±8KV/Air discharge ±15KV |
| Data interface | UART (TTL level) |
| Sensor surface hardness | 3H |
| Working temperature and humidity range | -25℃~+70℃; 45%~85%RH |
| Storage temperature and humidity range | -40℃~+85℃; 45%~95%RH |
Mechanical characteristics
| Project | Description | Unit |
| Dimensions | Φ12.8mm | mm |
| Ribbon | 5.6*4.8 | mm |
| Sensor size | 112*96 |
Electrical parameters
| Item | Min | Typical | Max | Unit | |
| Supply voltage | 3.0 | 3.3 | 3.6 | V | |
| Standby current (sensor) | - | 10 | 12 | μA | |
| Operating current (algorithm MCU) | 24 | 35 | 50 | mA | |
| Maping time | 50 | 60 | 70 | mA | |
| Eigenvalue generation time | 65 | 70 | 80 | ms | |
| Comparison time | 20 | 600 | 1100 | ms | |
| Power-on start time | - | 67 | 100 | ms | |
| ESD rating | Non-contact discharg | - | 15 | - | KV |
| Contact discharge | - | 8 | - | KV | |
